{"id":16576,"date":"2026-07-28T09:57:31","date_gmt":"2026-07-28T02:57:31","guid":{"rendered":"https:\/\/pmac.asia\/semiconnect-2026-viet-nam-co-the-bat-dau-tu-dau-trong-chuoi-gia-tri-ban-dan\/"},"modified":"2026-08-28T16:43:50","modified_gmt":"2026-08-28T09:43:50","slug":"semiconnect-2026-where-can-vietnam-start-in-the-semiconductor-value-chain","status":"publish","type":"post","link":"https:\/\/pmac.asia\/en\/semiconnect-2026-where-can-vietnam-start-in-the-semiconductor-value-chain\/","title":{"rendered":"SEMICONNECT 2026: Where can Vietnam start in the Semiconductor value chain?"},"content":{"rendered":"

The semiconductor industry is receiving significant attention in Vietnam, but opportunity does not mean that the country already has a clearly defined development path. Rather than focusing only on market potential, SemiConnect Vietnam 2026<\/strong> centered on a more practical question: Where can Vietnam participate in the semiconductor value chain based on its current capabilities, and what conditions need to be built in the next stage?<\/strong><\/em><\/p>\n

The program focused on MEMS and sensors, Advanced Packaging, intellectual property, patent mapping, and the development direction of Vietnam\u2019s semiconductor ecosystem<\/strong>. The panel discussion also addressed technology gaps, priorities for the next 5\u201310 years, and the challenge of developing a skilled workforce.<\/p>\n

PMAC\u2019s participation in SemiConnect 2026 was not simply about keeping up with a growing industry trend. It represents one of the first steps in PMAC\u2019s process of defining its role in the semiconductor sector in a clearer and more systematic way.<\/p>\n

\"PMAC

PMAC representatives at the SEMICONNECT 2026 semiconductor industry conference<\/p><\/div>\n

I. From Market Potential to Execution Capability<\/strong><\/h2>\n

One of the key messages from the conference was that Vietnam needs to identify areas that align with its existing capabilities rather than attempting to participate in every stage of the semiconductor value chain at the same time.<\/p>\n

Discussions at the event emphasized the importance of coordination among government agencies, businesses, universities, research institutes, and international partners in building a semiconductor ecosystem. Vietnam needs to identify suitable segments where it can gradually develop technological capabilities, human resources, and supporting supply chains.<\/p>\n

This approach suggests that Vietnam\u2019s challenge is not simply to attract more investment projects. More importantly, the country needs to convert the presence of international corporations into manufacturing experience, technical capabilities, and meaningful opportunities for domestic companies to participate in the value chain.<\/p>\n

II. MEMS and Sensors: From Sensing to Smart Industrial Systems<\/strong><\/h2>\n

At the conference, MEMS sensors were positioned as a bridge between the physical world and digital systems. Data used for AI, automation, predictive maintenance, industrial robotics, and energy management all begins with the ability of sensors to measure and capture signals.<\/p>\n

MEMS technologies are currently used across a wide range of industries, including consumer electronics, automotive, medical devices, energy, and industrial automation. According to the analyses presented at the event, this is one of the segments Vietnam could explore based on domestic application demand and its existing electronics manufacturing foundation.<\/p>\n

However, market opportunities do not mean that technological capabilities are already in place. The conference also highlighted gaps in MEMS fabrication, advanced sensor design, and the maturity of supporting supply chains.<\/p>\n

The roadmap discussed therefore extends beyond merely using or integrating sensors. It also looks toward building capabilities in design, packaging, calibration, testing, and product commercialization.<\/p>\n

This is particularly relevant for companies with existing foundations in electronics and industrial manufacturing. The opportunities do not lie only in the sensor components themselves, but also in the broader ecosystem of materials, equipment, integration, and downstream applications.<\/p>\n

\"Semiconductor

Semiconductor industry experts discussing MEMS and Sensors at the conference<\/p><\/div>\n

III. Advanced Packaging: The Bridge Between Chips and Products<\/strong><\/h2>\n

Another important topic at SemiConnect 2026 was Advanced Packaging<\/strong>, particularly as the semiconductor industry shifts from monolithic chips toward chiplet architectures and heterogeneous integration.<\/p>\n

Technologies such as 2.5D packaging, 3D packaging, and chiplets enable multiple functions to be integrated within a single platform, helping optimize performance, power consumption, cost, and product development time. Packaging is therefore increasingly becoming part of system architecture rather than simply the final stage after a chip has been fabricated.<\/p>\n

At the conference, the proposed roadmap for Vietnam was to develop step by step: strengthen existing packaging and testing capabilities, establish R&D centers, develop lab-to-fab models and pilot production lines, and increase the use of AI and automation in manufacturing processes.<\/p>\n

This roadmap also reflects an important reality: Vietnam\u2019s current packaging and testing capabilities are only an initial foundation and do not yet mean that the country has a complete Advanced Packaging ecosystem.<\/p>\n

Several challenges still need to be addressed, including gaps in core technologies, materials, supporting industries, technical skills, supply chains, and the ability to meet international standards. Advanced Packaging should therefore be viewed as a long-term development direction that must be built on real capabilities rather than as a transition that can happen within a short period of time.<\/p>\n

\"Panel

Panel discussion featuring leading semiconductor experts in Vietnam<\/p><\/div>\n

IV. Semiconductors Cannot Develop in Isolation<\/strong><\/h2>\n

The discussions at SemiConnect 2026 showed that semiconductors are increasingly interconnected with AI, automation, materials, measurement equipment, and electronics manufacturing. MEMS and sensors provide data for intelligent control systems. Advanced Packaging provides the foundation for applications requiring high performance, high interconnect density, and optimized energy consumption. Meanwhile, materials, thermal management technologies, intellectual property, testing, and process control all influence whether a product can be successfully commercialized.<\/p>\n

This explains why developing the semiconductor industry requires coordinated participation from businesses, government agencies, research institutes, universities, and international technology partners. No single company or project can independently build the entire ecosystem required.<\/p>\n

Vietnam\u2019s challenge is therefore not simply to choose a segment that is currently attracting attention, but to identify areas that can be developed from existing strengths and then build the supporting capabilities around those areas.<\/p>\n

\"Discussion

Discussion on the development path of Vietnam\u2019s semiconductor industry<\/p><\/div>\n

V. PMAC Enters a New Stage of Strategic Positioning<\/strong><\/h2>\n

PMAC has many years of experience in the electronics sector, including supplying products and solutions to customers in the semiconductor industry. However, as technology and global supply chain structures continue to evolve rapidly, this is the right time for PMAC to begin redefining its role in the ecosystem in a more formal, proactive, and strategic way.<\/p>\n

Participating in SemiConnect 2026 is one of the first steps in that process. The conference gave PMAC direct access to discussions on MEMS, sensors, Advanced Packaging, intellectual property, and Vietnam\u2019s semiconductor development roadmap, while also providing a clearer view of the gap between market potential and actual execution capabilities.<\/p>\n

At this stage, PMAC\u2019s priority is not to chase a particular technology trend or rush to define a specific segment in which to participate. The focus is on carefully evaluating areas where current capabilities intersect with emerging needs, understanding the standards that must be met, and identifying the value the company can build through collaboration with experts and international technology partners.<\/p>\n

This provides a foundation for PMAC to transform its accumulated experience in electronics into a clearer, more selective semiconductor strategy based on real capabilities.<\/p>\n

VI. Vietnamese Firms Need to Stay Realistic About Opportunities and Serious About Capabilities<\/strong><\/h2>\n

SemiConnect 2026 did not provide a single answer to the question of how Vietnam should develop its semiconductor industry. Instead, the conference helped clarify the technologies creating new opportunities, the foundations Vietnam already has, and the gaps that still need to be addressed. MEMS and Sensors were discussed in relation to practical application demand; Advanced Packaging was approached as a step-by-step development roadmap; and execution capability was emphasized as the condition required to turn strategic direction into tangible outcomes.<\/p>\n

For PMAC, participating in SemiConnect 2026 marks an important step in its long-term strategic positioning: understanding the structure of the industry, identifying the right intersections with existing capabilities, and gradually building meaningful value within the semiconductor ecosystem.<\/strong><\/p>\n

Contact PMAC to connect with our experts and explore solutions related to semiconductor materials, advanced manufacturing technologies, and semiconductor supply chains.<\/em><\/a><\/strong><\/p>\n

PMAC Joint Stock Company<\/span><\/h3>\n

Ho Chi Minh City Office:<\/strong>
4th Floor, HUTECH Building, D1 Road, Saigon Hi-Tech Park, Tang Nhon Phu Ward, Ho Chi Minh City, Vietnam<\/p>\n

Hanoi Office:<\/strong>
22B O2, Linh Dam Peninsula, Hoang Liet Ward, Hanoi, Vietnam<\/p>\n

Hotline:<\/strong>\u00a0+84 387 235 878<\/p>\n

Facebook:<\/strong>\u00a0PMAC<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"

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