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Posts by MC1-Hoàng

Home » Articles Posted by MC1-Hoàng
ai-chip-gpu-hbm-interposer-substrate
17 Sep
Uncategorized

What’s Inside an AI Chip? From GPUs and HBM to Interposers and Package Substrates

  • 18 September, 2026
  • Posted by author-avatar MC1-Hoàng
  • 0 comments
From the outside, an AI GPU is often viewed as a single chip. In reality, many modern AI chips are highly integrated systems composed o...

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16 Sep
News & Media, News & Media, News & Media

After the GPU Boom, Which Semiconductor Components Will Become AI’s Next Focal Point?

  • 17 September, 2026
  • Posted by author-avatar MC1-Hoàng
  • 0 comments
Over the past few years, GPUs have become almost synonymous with the artificial intelligence boom. The rise of large language models (L...

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15 Sep
News & Media, News & Media, News & Media, News & Media, News & Media, News & Media, Uncat

How Are PVD, CVD, and ALD Different? Three Thin-Film Deposition Technologies

  • 17 September, 2026
  • Posted by author-avatar MC1-Hoàng
  • 0 comments
A modern semiconductor chip is built from numerous material layers with different functions, created and processed sequentially on the ...

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What is ISO 17025
14 Sep
Uncategorized

What Is ISO 17025? Does Every Business Need to Apply It?

  • 16 September, 2026
  • Posted by author-avatar MC1-Hoàng
  • 0 comments
A company with an in-house quality control laboratory, a manufacturing plant with a chemical analysis laboratory, and an independent te...

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11 Sep
News & Media

Are Businesses Overlooking a “Gold Mine” in Old Circuit Boards?

  • 16 September, 2026
  • Posted by author-avatar MC1-Hoàng
  • 0 comments
The rapid growth of electronics, smart devices, and digitalization is creating an increasingly visible paradox: the more electronic dev...

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10 Sep
Uncategorized

How Do Coating Thickness Gauges Differ Between the Jewelry and Semiconductor Industry?

  • 16 September, 2026
  • Posted by author-avatar MC1-Hoàng
  • 0 comments
In manufacturing, metal coatings do more than define the appearance of a product. They also affect durability, material costs, and the ...

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09 Sep
Tech News, Tech News, Tech News, Tech News, Tech News, Tech News

What Are Fabless, Foundry, IDM, and OSAT? Why Can’t Any Semiconductor Company Make an Entire Chip on Its Own?

  • 9 September, 2026
  • Posted by author-avatar MC1-Hoàng
  • 0 comments
A chip may carry the name of NVIDIA, Qualcomm, Intel, or another semiconductor brand, but that does not mean all the technology inside ...

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08 Sep
Uncategorized

How Are Silicon, SiC and GaN Different? Why Is Each Material Suited to Different Applications?

  • 8 September, 2026
  • Posted by author-avatar MC1-Hoàng
  • 0 comments
A computer processor, an electric vehicle inverter, and a fast charger all rely on semiconductor devices, yet they are not necessarily ...

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08 Sep
PMAC News

What Is ISO 9001? Why Must Quality Be Managed as a System?

  • 8 September, 2026
  • Posted by author-avatar MC1-Hoàng
  • 0 comments
A batch of products meeting specifications does not necessarily mean that a company is managing quality effectively. Today’s results ma...

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What Is Glass Core Substrate? Why Is Glass Being Targeted for Next-Generation AI Chips?
07 Sep
Tech News, Tech News, Tech News

What Is Glass Core Substrate? Why Is Glass Being Targeted for Next-Generation AI Chips?

  • 8 September, 2026
  • Posted by author-avatar MC1-Hoàng
  • 0 comments
For many years, the semiconductor race largely focused on shrinking transistors to increase computing density on each chip. However, th...

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  • ai-chip-gpu-hbm-interposer-substrate
    What’s Inside an AI Chip? From GPUs and HBM to Interposers and Package Substrates
    17 September, 2026 No Comments
  • 2
    After the GPU Boom, Which Semiconductor Components Will Become AI’s Next Focal Point?
    16 September, 2026 No Comments
  • 2
    How Are PVD, CVD, and ALD Different? Three Thin-Film Deposition Technologies
    15 September, 2026 No Comments
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Recent Posts
  • ai-chip-gpu-hbm-interposer-substrate
    What’s Inside an AI Chip? From GPUs and HBM to Interposers and Package Substrates
    17 September, 2026 No Comments
  • 2
    After the GPU Boom, Which Semiconductor Components Will Become AI’s Next Focal Point?
    16 September, 2026 No Comments
  • 2
    How Are PVD, CVD, and ALD Different? Three Thin-Film Deposition Technologies
    15 September, 2026 No Comments

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Recent Posts
  • ai-chip-gpu-hbm-interposer-substrate
    What’s Inside an AI Chip? From GPUs and HBM to Interposers and Package Substrates
    17 September, 2026 No Comments
  • 2
    After the GPU Boom, Which Semiconductor Components Will Become AI’s Next Focal Point?
    16 September, 2026 No Comments
  • 2
    How Are PVD, CVD, and ALD Different? Three Thin-Film Deposition Technologies
    15 September, 2026 No Comments
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