Umicore and PMAC: A Milestone Partnership in Surface Finishing and Semiconductor Technologies

On July 23, 2026, PMAC was honored to welcome Mr. Joachim Grimm, Sales Manager, Technical Services, and Mr. Ken K.W. Ng, Regional Product Manager of Umicore Hong Kong, to its official office in Vietnam.

Held in a professional and open atmosphere, the visit provided an opportunity for both parties to review their collaboration, exchange insights into emerging trends in surface finishing and advanced materials, and discuss the future development of the electronics and semiconductor industries amid growing demand for high-performance technologies.

The visit also reinforced the relationship between Umicore and PMAC while enabling PMAC to gain valuable technical perspectives and stay updated on global technology trends. More importantly, it laid a solid foundation for future technical exchanges and long-term cooperation.

I. Umicore Representatives Visit PMAC’s Office in Vietnam

The meeting was conducted in a professional and collaborative environment, bringing together representatives from Umicore and the PMAC team. Both parties reflected on their ongoing partnership while sharing strategic perspectives for future cooperation.

Rather than focusing solely on existing products and solutions, the discussions centered on the evolving landscape of the electronics industry and advanced materials. The meeting also provided PMAC with valuable updates on the latest technological developments driven by Umicore’s research and development initiatives.

One of the key highlights of the visit was the shared recognition of the increasingly important role of surface finishing technologies in high-tech industries. As electronic devices continue to become smaller, more powerful, and more reliable, metallic coatings are no longer used merely for surface protection but have become a critical factor in determining the overall quality and performance of finished products.

Figure 1. Umicore Representatives Officially Visit PMAC’s Office in Vietnam

II. Exploring Emerging Trends in Surface Finishing Technologies

Over the years, surface finishing technologies have continuously expanded their range of applications. While electroplating was once primarily associated with jewelry, mechanical components, and corrosion protection, it is now widely recognized as an essential technology for advanced industries, particularly electronics and semiconductors.

During the meeting, both parties discussed the growing importance of functional materials and the increasingly stringent requirements for metallic coatings. Beyond providing electrical conductivity and corrosion resistance, these coatings are expected to deliver long-term stability and consistent performance throughout the product lifecycle.

At the same time, the rapid advancement of the electronics industry is creating new demands for surface finishing technologies. As electronic components become smaller, more densely integrated, and more sophisticated, electroplating processes play an increasingly vital role in ensuring manufacturing precision, product quality, and long-term reliability.

For manufacturers in the electronics sector, staying informed about global technological trends is not only essential for maintaining competitiveness but also for supporting the transition toward more advanced manufacturing capabilities.

III. When Electroplating Becomes an Essential Part of Semiconductor Manufacturing

Another important topic discussed during the meeting was the role of surface finishing technologies in the semiconductor industry, an area receiving increasing attention worldwide as well as in Vietnam.

Within modern semiconductor packaging and chip interconnection processes, metallic layers perform multiple critical functions, including electrical conduction, structural protection, and long-term operational reliability.

Three key technologies highlighted during the discussion included:

Redistribution Layer (RDL): A technology that redistributes electrical interconnections on semiconductor chips, allowing contact pads to be relocated for advanced package designs.
Copper Pillar: A technology that utilizes microscopic copper pillars to establish electrical connections between semiconductor dies and substrates, enabling higher interconnect density and improved signal performance.
Advanced Packaging: Next-generation semiconductor packaging technologies designed to enhance performance, optimize space utilization, and meet the increasingly demanding requirements of modern electronic devices.

Although each technology serves different purposes, all require metallic coatings with exceptionally high quality.

These coatings must provide:

Excellent thickness uniformity.
Strong adhesion to the substrate.
Superior filling capability for fine structures.
Long-term reliability throughout product operation.

These demanding requirements demonstrate that electroplating has evolved far beyond its traditional role as a protective coating process. Today, it is an integral part of the semiconductor and electronics manufacturing value chain.

IV. PMAC Connecting Global Technologies with Vietnamese Manufacturers

As Vietnam’s electronics and semiconductor industries continue to develop, access to advanced surface finishing technologies has become increasingly important for manufacturers seeking to improve production capabilities and product quality.

Through its collaboration with Umicore, PMAC is committed to serving as a bridge that brings international expertise, innovative solutions, and advanced technologies closer to Vietnamese businesses. Beyond supplying surface finishing solutions, PMAC also focuses on sharing technical knowledge, providing professional support, and accompanying manufacturers throughout their technology adoption journey.

This approach aligns with the growing needs of manufacturers striving to enhance product quality, optimize production processes, and comply with international technical standards.

Furthermore, maintaining regular technical exchanges with global partners enables PMAC to strengthen its engineering capabilities, broaden its understanding of industry trends, and establish a strong foundation for future technology transfer initiatives.

As the official distributor of Umicore in Vietnam, PMAC continues to connect world-class surface finishing technologies with the practical needs of domestic manufacturers, supporting the advancement of Vietnam’s electronics and high-tech manufacturing industries.

PMAC and Umicore Explore Opportunities in the Growing Semiconductor Industry

V. A Milestone for Long-Term Collaboration

The visit of Umicore representatives to PMAC represented more than a routine business meeting. It marked another meaningful milestone in the ongoing partnership between the two organizations.

Through discussions on technological trends, advanced materials, and emerging applications in the electronics industry, the meeting created a solid foundation for future technical cooperation while highlighting the growing importance of connecting global innovations with Vietnam’s manufacturing capabilities.

As the semiconductor and electronics industries continue to evolve, surface finishing technologies are expected to play an increasingly significant role in improving product quality and meeting ever-higher technical requirements.

Looking ahead, Umicore and PMAC remain committed to strengthening their collaboration by continuously embracing new technologies, enhancing technical expertise, and introducing advanced surface finishing solutions to Vietnamese manufacturers. Together, both organizations aim to contribute to the sustainable development of Vietnam’s electronics, advanced materials, and semiconductor industries.